| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for expanding a semiconductor wafer, capable of improving productivity of a semiconductor device as compared with conventional apparatuses and methods.SOLUTION: A semiconductor wafer expanding apparatus 101 for expanding a dicing tape 12 to which a semiconductor wafer is stuck includes: a contact member 21a for moving a ring-like frame to which the dicing tape is stuck; a movement mechanism 22 for moving the contact member between a no-load position 40 and a final expanding position 42; and a control device 30 which is a device for performing operation control of the movement mechanism to perform control for repeating tensile force application and tensile force release to/from the dicing tape during movement of the contact member from the no-load position up to the final expanding position and gradually increasing tensile force to the dicing tape in each tensile force application operation.SELECTED DRAWING: Figure 1 |
