发明名称 |
METHOD FOR PRODUCING CHIP |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a chip, capable of improving productivity by suppressing clogging of a dicing blade.SOLUTION: A method for producing a chip includes a step of: readying a substrate including a plurality of chip regions 201 to be formed each plurality of chips 100 and cut regions 202 and 203 separating the chip 100 set around the chip region 201 and electrically connecting with an inspection pad 8 for inspecting the ship 100, and onto which a wiring covered with a protection layer 14 is arranged; inspecting the chip 100 with the inspection pad 8; and removing the inspection pad 8 and wiring 7 with an etching.SELECTED DRAWING: Figure 8 |
申请公布号 |
JP2016021459(A) |
申请公布日期 |
2016.02.04 |
申请号 |
JP20140143929 |
申请日期 |
2014.07.14 |
申请人 |
CANON INC |
发明人 |
田村 秀男;小俣 好一;谷口 卓;田丸 勇治;大橋 亮治;佐藤 良太;根岸 俊雄;小薄 洋平 |
分类号 |
H01L21/822;B41J2/01;B41J2/14;B41J2/16;H01L21/3205;H01L21/768;H01L23/522;H01L27/04 |
主分类号 |
H01L21/822 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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