LIGHT-EMITTING DEVICE AND LIGHTING DEVICE PROVIDED WITH THE SAME

摘要

A light-emitting device capable of ensuring an electric connection between a light-emitting element and an electrode without generating any problem in practical use, by both connecting methods with a solder and a connector, and a lighting device provided with the light-emitting device are provided. The light-emitting device according to the present invention has a plurality of LED chips, and a soldering electrode land and a connector connecting electrode land electrically connected to the chips, on a ceramic substrate. The soldering electrode land is formed of a first conductive material having a function to prevent diffusion to a solder, and the connector connecting electrode land is formed of a second conductive material having a function to prevent oxidation.

主权项

1. A light-emitting device comprising:
a ceramic substrate having a rectangular outer shape in a top view; a plurality of LED chips positioned around a center of a primary surface of said ceramic substrate; a resin dam formed on the primary surface of said ceramic substrate and provided so as to surround a mounting area in which said plurality of LED chips are provided; a first electrode land and a second electrode land which are electrodes to be connected to a power supply and are electrically connected to said plurality of LED chips, said first and second electrode lands being provided outside said resin dam and near corners of the primary surface of the substrate diagonally opposite to each other, each of said first and second electrode lands having a shape defined by first and second sides along the sides of said ceramic substrate defining the corresponding corner, third and fourth sides shorter than and opposing to the first and second sides, respectively, and a fifth side between the third and fourth sides; a first wire pattern provided on said ceramic substrate including a first leading line, said first leading pattern being located between said first electrode land and said resin dam; a second wire pattern provided on said ceramic substrate including a second leading line, said second leading pattern being located between said second electrode land and said resin dam; and a resin layer provided attaching to an inner side of said resin dam and covering said plurality of LED chips, wherein said plurality of LED chips are electrically connected to said first and second electrode lands via said first and second leading patterns, respectively, at least one of said first and second sides of said first electrode land is longer in length than a width of said first leading pattern, and at least one of said first and second sides of said second electrode land is longer in length than a width of said second leading pattern.