USE OF RFID CHIP AS ASSEMBLY FACILITATOR

摘要

A method of assembling RFID components together while using an RFID chip that heats internally in order to assemble that RFID chip and another RFID component such as an antenna is followed while producing RFID assemblies or RFID devices. This RFID chip is associated with a member that has an electrical characteristic to develop heat internal of this RFID chip. An uncured adhesive is positioned between at least a portion of the RFID chip and a portion of the other RFID component. Action of the RFID chip internal member heats the RFID chip, heat emanating to the adhesive, resulting in adhesive curing into a cured adhesive joint attaching together the RFID chip and the other RFID component. This assembly is capable of being achieved without an external source of heat or pressure applied to the adhesive. Temperature monitoring is available to assess heat development in connection with threshold temperature designation.

主权项

1. A method of assembling RFID components together, comprising:
associating with an RFID chip a member having a chip diode built into the RFID chip and an electrical characteristic that imparts heat by electrical action internal of the RFID chip; providing at least one other RFID component adapted to be assembled together with the RFID chip; positioning an uncured adhesive into contact with the RFID chip and with the RFID antenna component; and generating electrical current by action of the member having an electrical characteristic, thereby heating the uncured adhesive and thus curing same into a cured adhesive joint, focusing an external source of energy onto the RFID chip, measuring the voltage of the chip diode for monitoring data for threshold heat level developing, and transmitting the data to control the external source of energy; and whereby the RFID chip and the other RFID component are assembled together by the cured adhesive joint