| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is supplied with power source by using rewiring connected to edge pads arranged in a peripheral part and inhibits voltage drop of power supply voltage.SOLUTION: A semiconductor device comprises: center pads arranged on a surface of a semiconductor chip in a central part; an insulation film formed on the surface of the semiconductor chip so as to expose the center pads at least partially; edge pads which are provided on the insulation film and formed corresponding to the at-least-partially-exposed center pads and between the center pads and one edge of the semiconductor chip; first rewiring provided on the insulation film, for connecting the at-least-partially-exposed center pads and the edge pads; and second rewiring provided on the insulation film between the edge pads and the one edge of the semiconductor chip.SELECTED DRAWING: Figure 1 |
