发明名称 LIQUID INJECTION HEAD, LIQUID INJECTION DEVICE AND MANUFACTURING METHOD OF LIQUID INJECTION HEAD
摘要 PROBLEM TO BE SOLVED: To provide a liquid injection head capable of reducing a space of necessary wiring outside a pair of connection regions bonded with a flexible wiring board among the wiring boards.SOLUTION: A liquid injection head comprises: a basic wiring board including a first connection region and a second connection region; a plurality of head units 70; and a plurality of individual wiring boards 78 including first connection portions 781, relay portions 783 and second connection portions 782 and electrically connecting the basic wiring board and each of the plurality of head units 70. The second connection portion 782 of an individual wiring board 78-1 is bent to a second connection region side and is fixed to the first connection region, the second connection portion 782 of an individual wiring board 78-2 is bent to a first connection region side and is fixed to the second connection region, and an interval between the individual wiring board 78-1 and the individual wiring board 78-2 and an interval between the relay portions at a basic wiring board side are greater in comparison with those at a head unit 70 side.SELECTED DRAWING: Figure 10
申请公布号 JP2016020031(A) 申请公布日期 2016.02.04
申请号 JP20140143538 申请日期 2014.07.11
申请人 SEIKO EPSON CORP 发明人 OKUI HIROAKI;TOGASHI ISAMU
分类号 B41J2/155;B41J2/01;B41J2/16 主分类号 B41J2/155
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