发明名称 FORMING METHOD FOR SINGLE CRYSTAL SILICON SEMICONDUCTOR THIN FILM
摘要 PROBLEM TO BE SOLVED: To grow an MSE epitaxial film made to have an N concentration lower than 1E+16 (atoms/cc) by using a polycrystalline SiC substrate as a raw material.SOLUTION: In the invention, there is used as a material a polycrystalline SiC substrate at or higher than 7E+15 (atoms/cc) and at or lower than 1E + 16 (atoms/cc), which is manufactured to have a stable N concentration. Said polycrystalline SiC is used as a material to set the Si molten liquid layer thickness at 25 to 200 μm, and a growth temperature between 1600 to 1850°C. Under said condition, an MSE epitaxial film is grown to have an N concentration lower than 1E + 16 (atoms/cc).SELECTED DRAWING: Figure 2
申请公布号 JP2016020288(A) 申请公布日期 2016.02.04
申请号 JP20140144040 申请日期 2014.07.14
申请人 NISSIN ELECTRIC CO LTD 发明人 YOSHIOKA HISASHI
分类号 C30B29/36;C30B19/10;H01L21/208 主分类号 C30B29/36
代理机构 代理人
主权项
地址