SEMICONDUCTOR PACKAGE ON PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

摘要

A package on package structure may be formed by fabricating or providing a bottom package having a substrate, at least one die on top of the substrate, and bonding pads on the top of the substrate. Next, a frame is formed on the bonding pads and connected to the bonding pads. Next, a package material is molded over the top of the substrate to encapsulate the frame, the die, and the pads or substantially encapsulates these components. Next, a portion of the molded package material is removed to expose at least a portion of the frame. The exposed frame portions are formed such that a desired fan in or fan out configuration is obtained. Next, a non-conductive layer is formed on the exposed frame. Last, a second package having a die or chip is connected to the exposed portion of the frame to form a package on package structure.

主权项

1. A packaged semiconductor device, comprising:
a first package having a first semiconductor die and a bonding pad; a second package having a second semiconductor die; and a frame connected to the bonding pad and the second package at an interconnect, wherein the interconnect is offset from the bonding pad.