PROCESSING APPARATUS, PROCESSING METHOD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

摘要

According to one embodiment, a processing apparatus includes a first supply section, a second supply section, a gas supply section, and a sublimation section. The first supply section supplies a first fluid on surfaces of a plurality of workpieces. The second supply section supplies a fluid containing a sublimable material on the surfaces of the plurality of workpieces to which the first fluid is supplied. The gas supply section supplies gas on the surfaces of the plurality of workpieces to which a fluid containing the sublimable material is supplied. The sublimation section sublimates a layer containing the sublimable material formed on each surface of the plurality of workpieces. The gas supply section controls a thickness of the layer containing the sublimable material formed each surface of the plurality of workpieces by controlling a flow velocity of the gas in each surface of the plurality of workpieces.

主权项

1. A processing apparatus comprising:
a first supply section that supplies a first fluid on surfaces of a plurality of workpieces; a second supply section that supplies a fluid containing a sublimable material on the surfaces of the plurality of workpieces to which the first fluid is supplied; a gas supply section that supplies gas on the surfaces of the plurality of workpieces to which a fluid containing the sublimable material is supplied; and a sublimation section that sublimates a layer containing the sublimable material formed on each surface of the plurality of workpieces, wherein the gas supply section controls a thickness of the layer containing the sublimable material formed each surface of the plurality of workpieces by controlling a flow velocity of the gas in each surface of the plurality of workpieces.