METHOD FOR BONDING FLAT CABLE AND BONDING OBJECT, ULTRASONIC BONDING DEVICE, AND CABLE

摘要

Provided is a method capable of reducing the amount of a coating part remaining between a conductor and a bonding object. A chip comes closer to an anvil so that the flat cable and the terminal are sandwiched between the chip and the anvil. The flat cable and the terminal are pressed so as to come close to each other. When the chip ultrasonically vibrates, vibrations of the chip propagate to the terminal, causing the terminal to ultrasonically vibrate. Then heat is generated in a plate part by friction between the chip and the plate part. The coating part being positioned between the conductor and the plate part melts from the generated heat and is removed. Thereby the conductor and the plate part come into contact with each other resulting in a solid-phase bonding together.

主权项

1. A bonding method for bonding a flat cable and a bonding object together by using an ultrasonic bonding device, the flat cable having a conductor coated with a coating part, comprising:
setting the flat cable and the bonding object between a chip attached to a horn and an anvil such that the chip and the anvil come into contact with the bonding object, the flat cable and the bonding object being pressed in such directions that the flat cable and the bonding object come close to each other, while the bonding object is ultrasonically vibrated by vibrations of the chip being in contact with the bonding object; and causing the coating part being positioned between the conductor and the bonding object to melt from heat generated by ultrasonic vibrations of the bonding object and to be removed, the conductor and the bonding object coming into contact with each other to be bonded together.