发明名称 DIE ATTACH SOLDER PREFORM CUTTER
摘要 A cutter to cut die attach solder preform material is disclosed. It is formed of: a base; a pair of raised blocks spaced apart on the base with each having a slot sized to accommodate a cutting blade configured to cleave the material to be cut, constrain the cutting blade to vertical movement, and maintain the squareness of the cutting blade with respect to the base for cutting material; an adjustable stop positioned forward of the cutting blade which is configured to be moved so as to set the length of the material to be cut by the cutting blade; and a linear scale positioned proximate to the adjustable stop which enables a measured length of the material to be cut. Methods of using the aforementioned cutter are also disclosed.
申请公布号 US2016031105(A1) 申请公布日期 2016.02.04
申请号 US201514831585 申请日期 2015.08.20
申请人 U.S. Army Research Laboratory ATTN: RDRL-LOC-I 发明人 Koebke M. Gail
分类号 B26D1/01;B25D1/00 主分类号 B26D1/01
代理机构 代理人
主权项 1. A cutter to cut die attach solder preform material comprising: a base; a pair of raised blocks spaced apart on the base with each having a slot sized to accommodate a cutting blade configured to cleave the material to be cut, constrain the cutting blade to vertical movement, and maintain the squareness of the cutting blade with respect to the base for cutting material; an adjustable stop positioned forward of the cutting blade which is configured to be moved so as to set the length of the material to be cut by the cutting blade; and a linear scale positioned proximate to the adjustable stop which enables a measured length of the material to be cut.
地址 Adelphi MD US