EPOXY RESIN COMPOSITION, RESIN SHEET, AND PREPREG, AND METAL-CLAD LAMINATE BOARD, PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE

摘要

The purpose of the present invention is to provide an epoxy resin composition that, when cured, is highly heat-resistant, is water-absorbent, and has a low dielectric constant. The purpose of the present invention is also to provide a resin sheet, a metal-clad laminate board, and a printed circuit board that use the epoxy resin composition and to provide a semiconductor device. This epoxy resin composition contains as essential components an epoxy resin that is represented by general formula (1) and an amine curing agent. (In the formula, the ratio ((a)/(b)) of (a) and (b) is 1-3, G represents a glycidyl group, and n represents the number of repetitions and is 0-5.)