CARRIER HEAD AND CHEMICAL MECHANICAL POLISHING APPARATUS

摘要

The present invention relates to a carrier head and a chemical mechanical polishing apparatus. The carrier head according to an embodiment of the present invention includes: a ring-shaped body; a support unit which is movably combined with the body while surrounding the body; a retaining ring which is provided in a ring shape and is located on the outside of a lower surface of the support unit; a membrane member which is fixed to a lower part of the support unit to be located inside the retaining ring, and pressurizes a substrate in a polishing process; and an outer ring which is located on an outer surface of the membrane member and has a hydrophobic surface.