| 摘要 |
PROBLEM TO BE SOLVED: To provide component mounting device and method that can enhance the mounting efficiency of a component having a pair of leads onto a board to enhance the productivity.SOLUTION: A component mounting device has a head for griping an electronic component 2 having a pair of leads 4, a head moving mechanism for moving the head to insert the leads 4 of the electronic component 2 into through-holes of a board, thereby mounting the electronic component onto the board, and a lead correction jig 17 having a pair of slope faces 45 and a pair of slope faces 55 which are inclined to different directions. The leads 4 of the electronic component 2 gripped by the head moved by the head moving mechanism are pressed against the slope faces 45 or the slope faces 55 by the lead correction jig 17, whereby the leads 4 are displaced to approach to or separate from each other, thereby correcting the lead width Lw.SELECTED DRAWING: Figure 6 |
