| 发明名称 |
ELECTRICAL COMPONENT |
| 摘要 |
An electrical component having a first package part of a first plastic compound. The first package part has a first trench-shaped formation. A first semiconductor body with an integrated circuit is disposed in the first trench-shaped formation. At least two traces, which run on an outer side of the first package part, are provided on a surface of the first trench-shaped formation, wherein the at least two traces are connected to the integrated circuit. The first trench-shaped formation is filled at least partially with a filling material of a second plastic compound to cover the first semiconductor body. |
| 申请公布号 |
US2016037641(A1) |
申请公布日期 |
2016.02.04 |
| 申请号 |
US201514812718 |
申请日期 |
2015.07.29 |
| 申请人 |
Micronas GmbH |
发明人 |
FRANKE Joerg;HEBERLE Klaus;BREITWIESER Oliver;KAUFMANN Timo |
| 分类号 |
H05K1/18 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electrical component comprising:
a first package part of a first plastic compound; a first trench-shaped formation formed in the first package part; a first semiconductor body with an integrated circuit arranged in the first trench-shaped formation; at least two traces formed on an outer side of the first package part and are provided on a surface of the first trench-shaped formation, the at least two traces being connected to the integrated circuit; and a filling material of a second plastic compound filled in the first trench-shaped formation that covers at least the first semiconductor body. |
| 地址 |
Freiburg DE |
