PRINTED WIRING BOARD

摘要

A printed wiring board includes an insulation layer, conductive pads formed on the insulation layer and positioned to connect an electronic component, and a conductive wiring pattern including first and second conductive patterns and formed on the insulation layer such that the conductive wiring pattern is extending between the conductive pads. The first pattern includes first wiring lines, the second pattern includes second wiring lines, the first and second conductive patterns are formed such that the first wiring lines and the second wiring lines are alternately arrayed on the insulation layer, each of the first wiring lines includes a first metal layer formed on an interface with the insulation layer, each of the second wiring lines includes a second metal layer formed on an interface with the insulation layer, and the first metal layer includes a metal material which is different from a metal material forming the second metal layer.

主权项

1. A printed wiring board, comprising:
an insulation layer comprising an insulative material; a plurality of conductive pads formed on the insulation layer such that the plurality of conductive pads is positioned to connect an electronic component; and a conductive wiring pattern comprising a first conductive pattern and a second conductive pattern and formed on the insulation layer such that the conductive wiring pattern is extending between the conductive pads, the first conductive pattern comprising a plurality of first wiring lines, the second conductive pattern comprising a plurality of second wiring lines, wherein the first conductive pattern and the second conductive pattern are formed such that the first wiring lines and the second wiring lines are alternately arrayed on the insulation layer, each of the first wiring lines comprises a first metal layer formed on an interface with the insulation layer, each of the second wiring lines comprises a second metal layer formed on an interface with the insulation layer, and the first metal layer comprises a metal material which is different from a metal material forming the second metal layer.