Package on Package Devices and Methods of Packaging Semiconductor Dies

摘要

Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal stud bumps are disposed between the first packaged die and the second packaged die. The metal stud bumps include a stick region, a first ball region coupled to a first end of the stick region, and a second ball region coupled to a second end of the stick region. The metal stud bumps include a portion that is partially embedded in a solder joint.

主权项

1. A semiconductor device, comprising:
a first substrate; a second substrate coupled to the first substrate; a plurality of metal stud bumps disposed between the first substrate and the second substrate, wherein each of the plurality of metal stud bumps includes a stick region, a first ball region coupled to a first end of the stick region, and a second ball region coupled to a second end of the stick region, the first ball region, the second ball region, and the stick region being a single continuous material, wherein the first ball region and the second ball region have a larger width than the stick region; and solder joints extending from the second substrate to the first substrate, each of the solder joints extending along a corresponding one of the plurality of metal stud bumps.