发明名称 |
Measurement device for the three-dimensional optical measurement of objects with a topometric sensor and use of a multi-laser-chip device |
摘要 |
A measurement device for the three-dimensional optical measurement of objects with a topometric sensor includes at least one projection unit for projecting a pattern onto an object and at least one image recording unit for recording the pattern that is scattered back from the object. The projection unit has a laser-light source and a pattern generator to which the laser light radiation from the laser-light source can be supplied. The laser-light source has at least one multi-laser-chip device having a plurality of laser diode chips in a common multi-laser-chip package, wherein the laser diode chips are attached to a mounting surface of the multi-laser-chip package and are in thermal communication with the multi-laser-chip package via the mounting surface. |
申请公布号 |
US2016033263(A1) |
申请公布日期 |
2016.02.04 |
申请号 |
US201514814547 |
申请日期 |
2015.07.31 |
申请人 |
GOM Gesellschaft fuer Optische Messtechnik mbH |
发明人 |
GOMERCIC Mladen;SCHMITLEIN Alexander;EVERS Tim;JOERCK Michael |
分类号 |
G01B11/25;G06T17/00;G06T7/00 |
主分类号 |
G01B11/25 |
代理机构 |
|
代理人 |
|
主权项 |
1. A measurement device for the three-dimensional optical measurement of objects with a topometric sensor, comprising:
at least one projection unit for projecting a projection pattern onto an object; at least one image recording unit for recording a scattered pattern that is scattered back from the object, wherein the projection unit has a laser-light source and a pattern generator to which laser light radiation from the laser-light source is supplied, wherein the laser-light source has at least one multi-laser-chip device having a plurality of laser diode chips in a common multi-laser-chip package, wherein the laser diode chips are attached to a mounting surface of the multi-laser-chip package and are in thermal communication with the multi-laser-chip package via a mounting surface. |
地址 |
Braunschweig DE |