发明名称 ELECTRODEPOSITION OF SILVER WITH FLUOROPOLYMER NANOPARTICLES
摘要 Electrolytic plating compositions and electrolytic plating processes for the co-deposition of silver or silver alloy with fluoropolymer nanoparticles are provided. The silver or silver alloy composite coating containing fluoropolymer nanoparticles has enhanced functional properties such as a reduced coefficient of friction. The electrolytic plating composition comprises: (a) a silver ion source comprising silver methane sulfonate (Ag-MSA); (b) a complexing agent comprising a compound comprising a nitrogen-containing heterocyclic ring; (c) a pre-mix dispersion comprising fluoropolymer nanoparticles particles having a mean particle size of from about 10 nm and about 500 nm and a surfactant; and (d) an auxiliary surfactant comprising a cationic fluorosurfactant, wherein the composition has a pH of from about 8 to about 14.
申请公布号 US2016032479(A1) 申请公布日期 2016.02.04
申请号 US201414776879 申请日期 2014.03.14
申请人 ENTHONE INC. 发明人 Li Jingye;Abys Joseph A.;Kudrak, JR. Edward J.
分类号 C25D15/00;C25D3/46;C25D3/64 主分类号 C25D15/00
代理机构 代理人
主权项 1. An electrolytic plating composition for depositing a composite silver or silver alloy coating on a substrate comprising: (a) a silver ion source comprising silver methane sulfonate (Ag-MSA); (b) a complexing agent comprising a compound comprising a nitrogen-containing heterocyclic ring; (c) a pre-mix dispersion comprising fluoropolymer nanoparticles particles having a mean particle size of from about 10 nm and about 500 nm and a surfactant; and (d) an auxiliary surfactant comprising a cationic fluorosurfactant, wherein the composition has a pH of from about 8 to about 14.
地址 West Haven CT US
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