SEMICONDUCTOR MOUNTING COMPONENT AND METHOD FOR MANUFACTURING SAME

摘要

This semiconductor mounting component has a semiconductor package, a wiring board, a solder bonding section, and a resin reinforcement section. Wiring is formed on the surface of the wiring board, and the semiconductor package is mounted on the wiring board. The solder bonding section electrically connects the semiconductor package and the wiring to each other. The resin reinforcement section is formed on the side surface of the solder bonding section such that a part of the solder bonding section is exposed. The solder bonding section has: a first solder region that is formed closer to the semiconductor package than the wiring board; and a second solder region that is formed closer to the wiring board than the semiconductor package.