| 主权项 |
1. A method, comprising:
securing a substrate to a carrier using one or more adhesive elements, wherein the device substrate exhibits a thermal co-efficient of expansion greater than that of the carrier; forming electronic elements on the substrate with the substrate thus secured to the carrier,
wherein said forming electronic elements comprises controlling deposition of material and removal of deposited material on the basis of an expected position of the device substrate relative to the carrier,wherein said forming electronic elements further comprises subjecting the device substrate to one or more temperature rises causing expansion of the device substrate, andwherein the one or more adhesive elements have an internal cohesive strength sufficiently high to return the device substrate to a same position on the carrier upon reversal of the one or more temperature rises; thereafter reducing the adhesion strength of at least one of the one or more adhesive elements to facilitate the release of the substrate from the carrier. |
