FILM FORMING APPARATUS AND FILM FORMING METHOD

摘要

A film forming apparatus, for forming a metal oxide film on an object, includes a holding unit and a heating unit. The holding unit includes a first heater and holds the object in a processing chamber. A first heater power supply supplies power to the first heater. A target electrode is electrically connected to a metal target provided above the holding unit. A sputtering power supply is electrically connected to the target electrode. An introduction mechanism supplies an oxygen gas toward the holding unit. The heating unit includes a second heater for heating the object and a moving mechanism for moving the second heater between a region in a first space disposed above the holding unit and a region in a second space separated from the first space. A second heater power supply supplies power to the second heater.

主权项

1. A film forming apparatus for forming a metal oxide film on an object, comprising:
a processing chamber; a holding unit, including a first heater, configured to hold the object in the processing chamber; a first heater power supply configured to supply power to the first heater; a target electrode electrically connected to a metal target provided above the holding unit; a sputtering power supply electrically connected to the target electrode; an introduction mechanism configured to supply an oxygen gas toward the holding unit; a heating unit including a second heater for heating the object and a moving mechanism for moving the second heater between a region in a first space disposed above the holding unit and a region in a second space separated from the first space; and a second heater power supply configured to supply power to the second heater.