发明名称 |
METHOD FOR PRODUCING POLISHING SLURRY, POLISHING ABRASIVE GRAINS, POLISHING SLURRY, AND METHOD FOR PRODUCING GLASS SUBSTRATE |
摘要 |
Provided are a method for producing a polishing slurry, polishing abrasive grains, and a polishing slurry with which polishing rate can be improved and the occurrence of damage to a glass substrate can be suppressed. Further provided is a method for producing a glass substrate using such a polishing slurry and polishing abrasive grains. This method for producing a polishing slurry including polishing abrasive grains is used in the polishing treatment of a glass substrate and is characterized by comprising: an addition process in which a binder is added to a raw material slurry that includes raw material abrasive grains which constitute the raw material for the polishing abrasive grains; a drying process in which the raw material slurry which includes the binder is dried to produce a mass of raw material abrasive grains containing the binder; and a sintering process in which the mass of raw material abrasive grains is sintered to produce an aggregate of raw material abrasive grains containing the binder. |
申请公布号 |
WO2016017819(A1) |
申请公布日期 |
2016.02.04 |
申请号 |
WO2015JP71894 |
申请日期 |
2015.07.31 |
申请人 |
HOYA CORPORATION |
发明人 |
TAMURA, KEN;TAMAKI, MASANORI;IIIZUMI, KYOSUKE |
分类号 |
C09K3/14;B24B37/00;C03C19/00;C09G1/02;G11B5/84 |
主分类号 |
C09K3/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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