发明名称 METHOD FOR PRODUCING POLISHING SLURRY, POLISHING ABRASIVE GRAINS, POLISHING SLURRY, AND METHOD FOR PRODUCING GLASS SUBSTRATE
摘要 Provided are a method for producing a polishing slurry, polishing abrasive grains, and a polishing slurry with which polishing rate can be improved and the occurrence of damage to a glass substrate can be suppressed. Further provided is a method for producing a glass substrate using such a polishing slurry and polishing abrasive grains. This method for producing a polishing slurry including polishing abrasive grains is used in the polishing treatment of a glass substrate and is characterized by comprising: an addition process in which a binder is added to a raw material slurry that includes raw material abrasive grains which constitute the raw material for the polishing abrasive grains; a drying process in which the raw material slurry which includes the binder is dried to produce a mass of raw material abrasive grains containing the binder; and a sintering process in which the mass of raw material abrasive grains is sintered to produce an aggregate of raw material abrasive grains containing the binder.
申请公布号 WO2016017819(A1) 申请公布日期 2016.02.04
申请号 WO2015JP71894 申请日期 2015.07.31
申请人 HOYA CORPORATION 发明人 TAMURA, KEN;TAMAKI, MASANORI;IIIZUMI, KYOSUKE
分类号 C09K3/14;B24B37/00;C03C19/00;C09G1/02;G11B5/84 主分类号 C09K3/14
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