STACK PACKAGES AND METHODS OF MANUFACTURING THE SAME

摘要

A stack package includes a substrate having connection terminals and a first chip on the substrate. The first chip has first connectors on edges thereof. A second chip is stacked on the first chip to expose outer portions of the first connectors. The second chip has second connectors on edges thereof. Connection members to connect the exposed outer portions of the first connectors to the connection terminals. Sidewall interconnectors to connect the exposed outer portions of the first connectors to the second connectors. The sidewall interconnectors extend from the exposed outer portions of the first connectors along sidewalls of the second chip to cover the second connectors.

主权项

1. A stack package comprising:
a substrate having bond fingers; a first chip on the substrate, the first chip having first connectors on edges thereof; a second chip stacked on the first chip to expose outer portions of the first connectors, the second chip having second connectors on edges thereof; a third chip stacked on the second chip to expose outer portions of the second connectors, the third chip having third connectors on edges thereof; metal wires to electrically connect the exposed outer portions of the first connectors to the bond fingers; and sidewall interconnectors to electrically connect the exposed outer portions of the first connectors to the second connectors and the third connectors wherein a portion of the sidewall interconnectors surround a first end portion of the metal wires.