| 发明名称 |
Integrated Circuit Device With Wire Bond Connections |
| 摘要 |
An integrated circuit assembly includes a die with a bond pad; a stud bump formed on the bond pad; and a ball bond formed on the stud bump. |
| 申请公布号 |
US2016035652(A1) |
申请公布日期 |
2016.02.04 |
| 申请号 |
US201514814342 |
申请日期 |
2015.07.30 |
| 申请人 |
Texas Instruments Incorporated |
发明人 |
Yano Genki;Kuroda Ayumu |
| 分类号 |
H01L23/495;H01L23/31;H01L23/00 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An integrated circuit assembly comprising:
a die with a bond pad; a stud bump formed on said bond pad; and a ball bond formed on said stud bump. |
| 地址 |
Dallas TX US |
