| 发明名称 |
METHOD OF FORMING A COMPOSITE SUBSTRATE FOR LAYERED HEATERS |
| 摘要 |
A method of forming a heater assembly for use in semiconductor processing includes thermally securing a heater substrate to an application substrate; and applying a layered heater having at least one functional layer to the heater substrate after the heater substrate is secured to the application substrate. The heater substrate defines a material having a coefficient of thermal expansion that is matched to a coefficient of thermal expansion of the functional layer. The material of the functional layer is not capable of withstanding the elevated temperature of the thermal securing step. |
| 申请公布号 |
US2016035602(A1) |
申请公布日期 |
2016.02.04 |
| 申请号 |
US201514875757 |
申请日期 |
2015.10.06 |
| 申请人 |
Watlow Electric Manufacturing Company |
发明人 |
Lindley Jacob R.;Meyer Dean J.;Glew Alexander D. |
| 分类号 |
H01L21/67;H02N13/00;H01C17/06;H01L21/683 |
主分类号 |
H01L21/67 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of forming a heater assembly for use in semiconductor processing comprising the following steps in sequence:
securing a heater substrate to an application substrate at an elevated temperature using a thermal bonding process; applying at least one functional layer to the heater substrate after the heater substrate is secured to the application substrate, wherein the heater substrate defines a material having a coefficient of thermal expansion that is matched to a coefficient of thermal expansion of a material of the functional layer, the material of the functional layer not being capable of withstanding the elevated temperature of the thermal securing step. |
| 地址 |
St. Louis MO US |
