APPARATUSES AND METHODS FOR COOLING A SURFACE

摘要

Methods and apparatuses for providing localized cooling of a surface are described. Localized cooling devices may include a thermal element configured to generate a temperature gradient in a cooling interface in contact with the surface. Temperature gradient may operate to facilitate conductive heat transfer from the surface, through the cooling interface, and out into the ambient environment. The thermal elements may include thermoelectric cooling elements (TECs), such as Peltier cooling elements. In some embodiments, the localized cooling devices may be configured to treat swelling associated with periorbital edema by providing convenient, efficient, and continuous cooling of the affected area.

主权项

1. An apparatus configured to provide localized cooling of a surface, the apparatus comprising:
at least one cooling interface configured to contact the surface; and at least one solid-state thermoelectric element thermally coupled to the at least one cooling interface, the at least one solid-state thermoelectric element being configured to facilitate a conductive transfer of heat from the surface through the at least one cooling interface, thereby decreasing a temperature of the surface.