| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which has a metal post for manufacturing a POP substrate having high reliability even when thermal stress is applied due to mismatch in physical properties of a first semiconductor package and a second semiconductor package which compose a POP package.SOLUTION: A printed wiring board is formed by a first circuit board 101 and a metal post 77 on the first circuit board 101. A ratio (h1/b) of a height h1 of the metal post 77 and a thickness b of the first circuit board 101 is larger than 0.1 and smaller than 1.0.SELECTED DRAWING: Figure 1 |
