发明名称 ELECTRONIC MODULE
摘要 PROBLEM TO BE SOLVED: To provide an electronic module which enables solder to be sufficiently supplied to a solder joint part when a surface mounting electronic component such as an aluminum electrolytic capacitor is mounted on a circuit board to improve the solder connection reliability after the component is mounted.SOLUTION: In an electronic module, a surface mounting electronic component is mounted on a circuit board by a conductive joint material and an adhesive. The electronic module includes grooves in an area forming a surface layer of the circuit board and on which the electronic component is mounted. The adhesive which joins the surface mounting electronic component to the circuit board is disposed in the grooves.SELECTED DRAWING: Figure 1
申请公布号 JP2016021451(A) 申请公布日期 2016.02.04
申请号 JP20140143796 申请日期 2014.07.14
申请人 HITACHI AUTOMOTIVE SYSTEMS LTD 发明人 UENO KEIKO;YOSHINARI HIDETO
分类号 H05K3/34;H05K1/02 主分类号 H05K3/34
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