发明名称 MANUFACTURING METHOD FOR A PIEZOELECTRIC LAYER ARRANGEMENT AND CORRESPONDING PIEZOELECTRIC LAYER ARRANGEMENT
摘要 A manufacturing method is provided for a piezoelectric layer arrangement and a corresponding piezoelectric layer arrangement. The manufacturing method includes the steps: depositing a first electrode layer on a substrate; depositing a first insulating layer on the first electrode layer; forming a through opening in the first insulating layer to expose the first electrode layer within the through opening; depositing a piezoelectric layer on the first insulating layer and on the first electrode layer within the through opening; back-polishing the resulting structure to form a planar surface, on which a piezoelectric layer area, surrounded by the first insulating layer, is exposed; and depositing and structuring a second electrode layer on the first insulating layer, which contacts the piezoelectric layer area.
申请公布号 US2016035959(A1) 申请公布日期 2016.02.04
申请号 US201514814182 申请日期 2015.07.30
申请人 Robert Bosch GmbH 发明人 MAYER Thomas;BUTZ Juergen;STRAUB Rainer;TOMASCHKO Jochen;SINGLE Christof
分类号 H01L41/04;H01L41/113;H01L41/187;H01L41/29;H01L41/314;H01L41/337;H01L41/047;H01L41/09 主分类号 H01L41/04
代理机构 代理人
主权项 1. A manufacturing method for a piezoelectric layer arrangement, comprising: depositing a first electrode layer on a substrate; depositing a first insulating layer on the first electrode layer; forming a through opening in the first insulating layer to expose the first electrode layer within the through opening; depositing a piezoelectric layer on the first insulating layer and on the first electrode layer within the through opening in order to produce a resulting structure; back-polishing the resulting structure to form a planar surface, on which a piezoelectric layer area surrounded by the first insulating layer is exposed; and depositing and structuring a second electrode layer on the first insulating layer, the second electrode layer contacting the piezoelectric layer area.
地址 Stuttgart DE