发明名称 |
STRESS IN N-CHANNEL FIELD EFFECT TRANSISTORS |
摘要 |
A fin field-effect transistor (FinFET) includes a gate stack on a surface of a semiconductor fin. The semiconductor fin may include a capping material and a stressor material. The stressor material is confined by the capping material to a region proximate the gate stack. The stressor material provides stress on the semiconductor fin proximate the gate stack. |
申请公布号 |
US2016035891(A1) |
申请公布日期 |
2016.02.04 |
申请号 |
US201414448548 |
申请日期 |
2014.07.31 |
申请人 |
QUALCOMM Incorporated |
发明人 |
XU Jeffrey Junhao;RIM Kern;SONG Stanley Seungchul;YEAP Choh Fei |
分类号 |
H01L29/78;H01L29/66 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
|
主权项 |
1. A method for fabricating a fin field effect transistor (FinFET) device on a semiconductor substrate, comprising:
forming a gate stack on a surface of a semiconductor fin; depositing a dielectric layer on the semiconductor fin to be substantially coplanar with a surface of a conductive gate of the gate stack; recessing the conductive gate to be below a level of the dielectric layer; depositing a stressor material onto a recessed surface of the conductive gate and the dielectric layer; confining the stressor material; and changing a volume of the stressor material to stress the semiconductor fin proximate the conductive gate. |
地址 |
San Diego CA US |