发明名称 |
Image Sensor Device and Method |
摘要 |
A system and method for blocking heat from reaching an image sensor in a three dimensional stack with a semiconductor device. In an embodiment a heat sink is formed in a back end of line process either on the semiconductor device or else on the image sensor itself when the image sensor is in a backside illuminated configuration. The heat sink may be a grid in either a single layer or in two layers, a zig-zag pattern, or in an interleaved fingers configuration. |
申请公布号 |
US2016035771(A1) |
申请公布日期 |
2016.02.04 |
申请号 |
US201514880720 |
申请日期 |
2015.10.12 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
Huang Kuo-Chin;Wang Tzu-Jui;Chen Szu-Ying;Yaung Dun-Nian;Liu Jen-Cheng;Chou Bruce C.S.;Tu Jung-Kuo;Hsieh Cheng-Chieh |
分类号 |
H01L27/146;H01L31/024 |
主分类号 |
H01L27/146 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method of manufacturing a semiconductor device, the method comprising:
forming a pixel within an image sensor; bonding the image sensor to a semiconductor device, the semiconductor device comprising a substrate and a heat sink at least partially located in a first metallization layer between the pixel and the substrate; and forming a thermal via extending through the image sensor and in thermal connection with the heat sink. |
地址 |
Hsin-Chu TW |