| 发明名称 |
CHIP PACKAGE AND CHIP ASSEMBLY |
| 摘要 |
A chip package is provided. The chip package may include an electrically conductive carrier; at least one first chip including a first side and a second side opposite of the first side, with its second side being electrically contacted to the electrically conductive carrier; an insulating layer over at least a part of the electrically conductive carrier and over at least a part of the first side of the chip; at least one second chip arranged over the insulating layer and next to the first chip; encapsulating material over the first chip and the second chip; and electrical contacts which extend through the encapsulation material to at least one contact of the at least one first chip and to at least one contact of the at least one second chip. |
| 申请公布号 |
US2016035700(A1) |
申请公布日期 |
2016.02.04 |
| 申请号 |
US201514880373 |
申请日期 |
2015.10.12 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Hosseini Khalil;Mahler Joachim;Kalz Franz-Peter;Voelter Joachim;Wombacher Ralf |
| 分类号 |
H01L25/065;H01L23/498;H01L23/31;H01L23/495 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip package, comprising:
an electrically conductive carrier; at least one first chip, the first chip comprising a first side and a second side opposite the first side, with its second side being electrically contacted to the electrically conductive carrier; an insulating layer over at least a part of the electrically conductive carrier and over at least a part of the first side of the chip; at least one second chip over the insulating layer; encapsulating material over the first chip and the second chip; and electrical contacts which extend through the encapsulation material to at least one contact of the at least one first chip and to at least one contact of the at least one second chip, wherein the second chip is arranged next to the first chip. |
| 地址 |
Neubiberg DE |
