发明名称 METHOD FOR MANUFACTURING TOUCH-PANEL CONDUCTIVE SHEET, AND TOUCH-PANEL CONDUCTIVE SHEET
摘要 An object of the invention is to provide a method for more easily manufacturing a touch-panel conductive sheet in which end portions of lead-out wires are collected on one surface side of a substrate with high productivity, and a touch-panel conductive sheet. The method for manufacturing a touch-panel conductive sheet of the invention includes: forming, on a rear surface of a substrate, first detection electrodes and rear surface-side wires of which one ends are electrically connected to the first detection electrodes and the other ends have first pad portions, and on a front surface of the substrate, second detection electrodes, second lead-out wires which are electrically connected to the second detection electrodes, and second pad portions which are arranged at positions opposed to the first pad portions via the substrate; forming through holes penetrating the first pad portions, the substrate, and the second pad portions; and producing through wires which electrically connect the first pad portions and the second pad portions by filling the through holes with a conductive material to form first lead-out wires which include the rear surface-side wires and the through wires and are electrically connected to the first detection electrodes.
申请公布号 US2016034081(A1) 申请公布日期 2016.02.04
申请号 US201514883339 申请日期 2015.10.14
申请人 FUJIFILM Corporation 发明人 ICHIKI Akira
分类号 G06F3/047;H05K1/02;H05K1/11;G06F3/044;H05K3/40 主分类号 G06F3/047
代理机构 代理人
主权项 1. A method for manufacturing a touch-panel conductive sheet, comprising: forming, on a rear surface of a substrate, first detection electrodes and rear surface-side wires of which one ends are electrically connected to the first detection electrodes and the other ends have first pad portions, and on a front surface of the substrate, second detection electrodes, second lead-out wires which are electrically connected to the second detection electrodes, and second pad portions which are arranged at positions opposed to the first pad portions via the substrate; forming through holes penetrating the first pad portions, the substrate, and the second pad portions; and producing through wires which electrically connect the first pad portions and the second pad portions by filling the through holes with a conductive material to form first lead-out wires which include the rear surface-side wires and the through wires and are electrically connected to the first detection electrodes.
地址 Tokyo JP