发明名称 |
METHOD FOR MANUFACTURING TOUCH-PANEL CONDUCTIVE SHEET, AND TOUCH-PANEL CONDUCTIVE SHEET |
摘要 |
An object of the invention is to provide a method for more easily manufacturing a touch-panel conductive sheet in which end portions of lead-out wires are collected on one surface side of a substrate with high productivity, and a touch-panel conductive sheet. The method for manufacturing a touch-panel conductive sheet of the invention includes: forming, on a rear surface of a substrate, first detection electrodes and rear surface-side wires of which one ends are electrically connected to the first detection electrodes and the other ends have first pad portions, and on a front surface of the substrate, second detection electrodes, second lead-out wires which are electrically connected to the second detection electrodes, and second pad portions which are arranged at positions opposed to the first pad portions via the substrate; forming through holes penetrating the first pad portions, the substrate, and the second pad portions; and producing through wires which electrically connect the first pad portions and the second pad portions by filling the through holes with a conductive material to form first lead-out wires which include the rear surface-side wires and the through wires and are electrically connected to the first detection electrodes. |
申请公布号 |
US2016034081(A1) |
申请公布日期 |
2016.02.04 |
申请号 |
US201514883339 |
申请日期 |
2015.10.14 |
申请人 |
FUJIFILM Corporation |
发明人 |
ICHIKI Akira |
分类号 |
G06F3/047;H05K1/02;H05K1/11;G06F3/044;H05K3/40 |
主分类号 |
G06F3/047 |
代理机构 |
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代理人 |
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主权项 |
1. A method for manufacturing a touch-panel conductive sheet, comprising:
forming, on a rear surface of a substrate, first detection electrodes and rear surface-side wires of which one ends are electrically connected to the first detection electrodes and the other ends have first pad portions, and on a front surface of the substrate, second detection electrodes, second lead-out wires which are electrically connected to the second detection electrodes, and second pad portions which are arranged at positions opposed to the first pad portions via the substrate; forming through holes penetrating the first pad portions, the substrate, and the second pad portions; and producing through wires which electrically connect the first pad portions and the second pad portions by filling the through holes with a conductive material to form first lead-out wires which include the rear surface-side wires and the through wires and are electrically connected to the first detection electrodes. |
地址 |
Tokyo JP |