发明名称 |
SYSTEMS AND METHODS FOR REDUCING LEAKAGE POWER OF A SYSTEM ON CHIP WITH INTEGRATED THERMOELECTRIC COOLING |
摘要 |
Systems, methods, and computer programs are disclosed for reducing leakage power of a system on chip (SoC). One such method comprises monitoring a plurality of temperature differentials across a respective plurality of thermoelectric coolers on a system on chip (SoC). Each of the thermoelectric coolers is dedicated to a corresponding one of a plurality of chip sections on the SoC. The thermoelectric coolers are controlled based on the plurality of temperature differentials to minimize a sum of a combined power consumption of the plurality of chip sections and the plurality of corresponding dedicated thermoelectric coolers. |
申请公布号 |
US2016033975(A1) |
申请公布日期 |
2016.02.04 |
申请号 |
US201414446258 |
申请日期 |
2014.07.29 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
MITTAL RAJAT;PARK HEE JUN;KANG YOUNG HOON |
分类号 |
G05D23/19;G05B13/02 |
主分类号 |
G05D23/19 |
代理机构 |
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代理人 |
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主权项 |
1. A method for reducing leakage power of a system on chip, the method comprising:
monitoring a plurality of temperature differentials across a respective plurality of thermoelectric coolers on a system on chip, each of the thermoelectric coolers dedicated to a corresponding one of a plurality of chip sections on the SoC; and controlling the plurality of thermoelectric coolers based on the plurality of temperature differentials to minimize a sum of a combined power consumption of the plurality of chip sections and the plurality of corresponding dedicated thermoelectric coolers. |
地址 |
San Diego CA US |