发明名称 SYSTEMS AND METHODS FOR REDUCING LEAKAGE POWER OF A SYSTEM ON CHIP WITH INTEGRATED THERMOELECTRIC COOLING
摘要 Systems, methods, and computer programs are disclosed for reducing leakage power of a system on chip (SoC). One such method comprises monitoring a plurality of temperature differentials across a respective plurality of thermoelectric coolers on a system on chip (SoC). Each of the thermoelectric coolers is dedicated to a corresponding one of a plurality of chip sections on the SoC. The thermoelectric coolers are controlled based on the plurality of temperature differentials to minimize a sum of a combined power consumption of the plurality of chip sections and the plurality of corresponding dedicated thermoelectric coolers.
申请公布号 US2016033975(A1) 申请公布日期 2016.02.04
申请号 US201414446258 申请日期 2014.07.29
申请人 QUALCOMM INCORPORATED 发明人 MITTAL RAJAT;PARK HEE JUN;KANG YOUNG HOON
分类号 G05D23/19;G05B13/02 主分类号 G05D23/19
代理机构 代理人
主权项 1. A method for reducing leakage power of a system on chip, the method comprising: monitoring a plurality of temperature differentials across a respective plurality of thermoelectric coolers on a system on chip, each of the thermoelectric coolers dedicated to a corresponding one of a plurality of chip sections on the SoC; and controlling the plurality of thermoelectric coolers based on the plurality of temperature differentials to minimize a sum of a combined power consumption of the plurality of chip sections and the plurality of corresponding dedicated thermoelectric coolers.
地址 San Diego CA US