A resistive film is applied to a conductive substrate. Ductile particles are disposed substantially uniformly throughout the resistive film. Brittleness of the resistive film is thereby reduced.
申请公布号
WO2016018366(A1)
申请公布日期
2016.02.04
申请号
WO2014US49144
申请日期
2014.07.31
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;ANTHONY, THOMAS;CHANG, SEONGSIK
