SEMICONDUCTOR PACKAGE STACK STRUCTURE HAVING INTERPOSER SUBSTRATE

摘要

Explained is a semiconductor package stack structure which comprises: a lower semiconductor package; an interposer substrate arranged on the lower semiconductor package and having a horizontal width greater than a horizontal width of the lower semiconductor package; an upper semiconductor package arranged on the interposer substrate; and underfill portions filling a space between the lower semiconductor package and the interposer substrate and surrounding side surfaces of the lower semiconductor package.