| 摘要 |
According to a first embodiment, an in-line cure device for a TCP/COF package comprises: a POT device which coats a liquid resin on a surface of a chip; a pre-cure oven which primarily and provisionally cures the coated resin; an unloader which protects a bonding unit by winding a bonded film tape and a spacer tape for shipment on a reel together; and a curing device interposed between the pre-cure oven and the unloader to apply a predetermined temperature to a resin made of a high heat-resistant polymer material so as to prevent deformation of a tap package and generation of static electricity due to a high temperature. The curing device can be connected to the pre-cure oven and the unloader in line. |
