METHOD FOR ROUNDING EDGES OF SOLID PARTS GENERATED FROM SOLID STARTING MATERIAL AND SOLID PRODUCTS PRODUCED BY THIS METHOD

摘要

The invention relates to a method for rounding edges of solid wafers and addresses the problem of providing a method for rounding a peripheral edge of the wafer that is already present, for avoiding the creation of sharp edges after a process step in which the wafer is divided, and for minimising the effort involved in edge rounding in one working process. The problem is solved by generating at least one peripheral recess (7) on an outer surface of the cylindrical solid starting material (1) or on the lateral surfaces of the cuboid solid starting material (1) such that, at all its points, the recess is equally spaced to a base surface or top surface of the solid starting material (1).