发明名称 |
ELECTRONIC COMPONENT HAVING A CORROSION-PROTECTED BONDING CONNECTION AND METHOD FOR PRODUCING THE COMPONENT |
摘要 |
The invention relates to an electronic component (1) having a corrosion-protected bonding connection and a method for producing said component. For this purpose the electronic component (1) has at least one semiconductor chip (3) on a substrate (4). Moreover, a bonding connection at risk of corrosion is provided on the semiconductor chip (3). For encapsulation of the at least one semiconductor chip (3) and the at least one bonding connection at risk of corrosion, said semiconductor chip and bonding connection are surrounded by a hermetically sealing housing (5). The hermetically sealed bonding connection is a bonding wire connection (2) which is fully enclosed in the housing (5), in which the substrate (4) is at least partially enclosed. The substrate (4) has at least one surface-mounted hydrolysis-sensitive component (6) in the housing (5). |
申请公布号 |
EP2803082(B1) |
申请公布日期 |
2016.02.03 |
申请号 |
EP20120798672 |
申请日期 |
2012.11.29 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
DUERR, JOHANNES;BECKER, ROLF;LAMERS, SVEN;MUELLER, LUTZ;BEZ, FABIAN;SCHLECHT, MICHAEL |
分类号 |
H01L23/053;H01L23/26 |
主分类号 |
H01L23/053 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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