| 摘要 |
Parts of electronic components are not exposed to temperature deviating from an appropriate operation temperature range when an electric characteristic test of a semiconductor module having an interposer substrate over which plural kinds of electronic components are mounted is carried out. A heat sink for an electronic component is incorporated in a lid of a test socket used for an electric characteristic test of an MCM. A heat dissipation sheet is attached to part of the bottom face of the heat sink and an adiabatic sheet is attached to another part. The heat dissipation sheet has thermal conductivity larger than the adiabatic sheet and transfers heat generated from an electronic component of a high heat value to the heat sink during operation. The adiabatic sheet inhibits the heat generated from an electronic component of high heat value from being transferred to another electronic component through the heat sink. |
