COMPOSITION FOR FORMING CONDUCTIVE FILM, AND CONDUCTIVE FILM MANUFACTURING METHOD USING SAME

摘要

Provided is a composition for forming a conductive film, said composition containing: copper oxide particles (A) having an average particle size of 10-500 nm; copper particles (B) having an average particle size of 100-1000 nm; a polyol compound (C) which has two or more hydroxyl groups in the molecule; and at least one solvent (D) selected from the group consisting of water, and a water-soluble solvent. The ratio of the total mass (W A ) of the copper oxide particles (A) to the total mass (W B ) of the copper particles (B) is W A :W B =1:3-3:1, and the ratio of the sum total mass (W AB ) of the copper oxide particles (A) and the copper particles (B) to the total mass (W C ) of the polyol compound (C) is W AB :W C =20:1-2:1. The composition is capable of forming a conductive film which has high conductivity, and exhibits excellent adhesion to a substrate. Also provided is a conductive film manufacturing method using the composition.