| 摘要 |
<p>The component has an optoelectronic chip (1) fastened to a chip carrier part (2) of a lead frame (7). The frame has a terminal or connector part arranged spaced from the chip carrier part (2). The terminal part (8) is conductively connected to an electric contact of the chip. The optoelectronic chip and at least part of the chip carrier part are surrounded by a cladding (3) such that the external terminals extend from the cladding. The chip carrier part has at least three external terminals (4,5,6). These extend from the cladding at different points, spaced from each other. Preferably the external terminals extend from the cladding (3) in a star configuration.</p> |
