| 摘要 |
968,515. Semi-conductor devices. SIEMENSSCHUCKERTWERKE A.G. Nov. 2, 1961 [Nov. 2, 1960], No. 39345/61. Heading H1K. A housing for enclosing a semi-conductor element has a first housing part connected directly or indirectly by hard soldering or welding to a second housing part, and has a shield between the joint and the semiconductor element protecting the latter from material produced by the jointing process and acting as a guide to locate the second housing part relative to the first. Two embodiments are illustrated in which silicon rectifiers are enclosed in casings differing mainly in the formation of their shields. Fig. 1 shows an embodiment having a shield 8 integral with the base-plate. This is surrounded by a ring 9 of a metal such as iron which is hard soldered to the base-plate. When the other part of the housing is projection welded to this ring at the ridged portion 9a, sputtered material cannot reach ,the semi-conductor element. In the embodiment shown in Fig. 2 the shield is formed by an upturned part of the ring 15 which is hard soldered to the base-plate and to which the cap is subsequently welded. The rim of the ring 15 which contacts the inner surface of the cap may be slightly studded, Fig. 3 (not shown), or insulated over most of its area to prevent substantial current from by-passing the desired welding area along ridge 9a. The outer surface of the upper part of the shield 8 in the first embodiment may be similarly treated. It is stated that the shield may be one of a number of portions of the housing parts which interengage to form a labyrinth. |
