发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
摘要 The present invention relates to a semiconductor device and a method for fabricating the same. The semiconductor device includes a substrate which includes a cell array region and a peripheral circuit region; a stacked structure which is arranged on the substrate of the cell array region, and includes electrodes and insulating layers which are alternately stacked; a plurality of peripheral gate structures which are arranged on the substrate of the peripheral circuit region, and are separated from each other in a direction; and residual spacers which are arranged on both sidewalls of the peripheral gate structures. Each of the peripheral structures includes a peripheral gate pattern on the substrate, and a peripheral gate spacer on the sidewall of the peripheral gate pattern. Each of the residual spacers includes a stacked sacrificial pattern and an insulating pattern. The insulating pattern includes the same material as the insulting layers constituting the stacked structure.
申请公布号 KR20160012298(A) 申请公布日期 2016.02.03
申请号 KR20140093314 申请日期 2014.07.23
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JUNG, WON SEOK;KANG, CHANG SEOK;PAEK, SEUNG WOO;YANG, IN SEOK;JOO, KYUNG JOONG
分类号 H01L27/115;H01L21/8247;H01L29/788 主分类号 H01L27/115
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