| 摘要 |
<p>1,064,513. Solar cell assemblies. T.R.W. Inc. June 10, 1964 [June 10, 1963], No. 24127/64. Heading H.1K. A plurality of solar cells are interconnected by bonding to a conductive layer on a circuit board at the same time as the circuit board is bonded to a substrate. In the illustrated arrangement the cells 22 (Fig. 1) in each row are connected in parallel between conductive stripes 21 on the board and strips 26, the strips and stripes of adjacent rows being joined to provide series connection of the rows. The substrate may be of aluminium or preferably tinned beryllium and the board a flexible strip of epoxy resin with tinned copper stripes on both faces, those on the lower face serving to key the solder to the board. Each solar cell of silicon has on its lower face a tinned nickel coating and on its upper face, two nickel strips joined at one end by a solder strip which engages the conductive strip 26. The substrate circuit board, cells and connecting strips are assembled in a jig and bonded together by heating. A thermosetting conductive epoxy resin may replace solder in all joints of the assembly.</p> |
