SUBSTRATE FOR FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME, AND FLEXIBLE PRINTED WIRING BOARD USING SAME

摘要

It is an object of the present invention to provide a substrate for a flexible printed circuit board having high long-term heat resistance and oil resistance, a method for manufacturing the same, and a flexible printed circuit board using the same. A flexible printed circuit board according to the present invention includes an insulating flexible base film, a conductive pattern made of copper disposed on a surface side of the base film, and a protective film disposed on a surface side of the conductive pattern with an adhesive layer therebetween. The flexible printed circuit board further includes a shielding layer disposed on a surface of the conductive pattern, the shielding layer preventing leakage of copper or permeation of components reactive with copper. The main component of the shielding layer may be nickel (Ni), tin (Sn), or aluminum (Al). The shielding layer may be formed by a plating on the surface of the conductive pattern. The average thickness of the shielding layer may be 0.01 to 6.0 µm.