| 摘要 |
The sensor has a current conductor (3) including integrally shaped first and second electrical terminals (4, 5) that are arranged at a side of a housing (7). An active surface of a semiconductor chip (1) faces the current conductor. A set of electrical connection surfaces of the semiconductor chip is connected to a third set of electrical terminals (6) by a set of bumps (8), where another set of bumps (9) is located on the current conductor or on projections (16) of the current conductor and electrically separated from the semiconductor chip by an isolation layer. |
