发明名称 電子部品装着装置
摘要 <P>PROBLEM TO BE SOLVED: To protect an electronic component so that a cap reliably covers a mounted case. <P>SOLUTION: A recognition-processing device recognizes an image taken by a substrate recognition camera 17 to recognize a position of a shield case 20 mounted on a printed circuit board P. Based on such recognition results, a suction nozzle 18 is corrected and moved, so that the suction nozzle 18 is moved downward until an outward inclination face inclined outward of each V-shaped holding part 22B2 of a case cap 22 comes into contact with an outer peripheral portion of an upper wall 20B of the shield case 20. Then, vacuum suction with the suction nozzle 18 is canceled to move the suction nozzle 18 upward. Under a non vacuum-suction state, the suction nozzle 18 is merely moved downward to move the case cap 22 downward and push it. Each holding part 22B2 of a holding claw 22B is fitted with each mounting opening 21 opened on a peripheral wall 20A of the shield case 20, so as to mount the case cap 22 to the shield case 20. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5852366(B2) 申请公布日期 2016.02.03
申请号 JP20110185392 申请日期 2011.08.28
申请人 ヤマハ発動機株式会社 发明人 小野 哲治;本間 裕;橋本 将敏
分类号 H05K13/04;H05K9/00 主分类号 H05K13/04
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