Universal lead frame for flat no-leads packages

摘要

A universal lead frame for semiconductor packages includes a solid lead frame sheet comprising an electrically conductive material and a plurality of columns etched into the lead frame sheet and distributed with a predetermined lead pitch so that the universal lead frame has a solid first main side opposite the columns and a patterned second main side opposite the first main side. A method of manufacturing the universal lead frame includes providing a solid lead frame sheet of an electrically conductive material and etching a plurality of columns into the lead frame sheet so that the columns are distributed with a predetermined lead pitch and the universal lead frame has a solid first main side opposite the columns and a patterned second main side opposite the first main side. A method of manufacturing molded semiconductor packages using the universal lead frame is also provided.

主权项

1. A universal lead frame for semiconductor packages, comprising:
a solid lead frame sheet comprising an electrically conductive material; and a plurality of columns etched into the lead frame sheet and distributed with a predetermined lead pitch so that the universal lead frame has a solid first main side opposite the columns and a patterned second main side opposite the first main side, wherein an outer periphery of the lead frame sheet is devoid of the columns, and wherein the columns are arranged in groups of uniformly spaced columns, the groups of columns being spaced apart from one another by a region of the lead frame sheet devoid of the columns.